Memory & Flash Crisis Update (March 2026)

Semiconductor

The global memory market entered 2026 in a state of structural supply constraint. AI infrastructure demand has reallocated semiconductor manufacturing capacity toward HBM for GPU accelerators, creating scarcity in conventional DRAM and NAND flash products.

Call Notes: Memory & NAND Market Update (Dec 2025)

Just before the Holiday break, I participated in an advisory session on the current state of the memory and NAND market, which is experiencing a marked upturn driven by constrained supply of legacy DRAM products and surging demand from higher-margin products like HBM and DDR5.

Here I’m sharing some of the notes I used for that discussion.

Call Notes: Memory Market Supply Constraints and Rising Prices (Nov 2025)

Abstract image of earnings.

Legacy and mobile DRAM types, including DDR4 and LPDDR5X, face severely extended delivery lead times, while contract prices for DRAM and NAND flash are rising sharply. This is leaving Smartphone OEMs and SoC vendors with elevated memory cost burdens that threaten margins and will likely force higher device prices.

Research Note: Marvell Solidifies CXL Leadership w/ Ecosystem-Wide Interoperability

Marvell CXL

The CXL ecosystem is moving quickly from concept to deployment as hyperscalers, OEMs, and chipmakers seek new ways to address the memory bottlenecks that limit AI, cloud, and high-performance computing workloads. In this environment, interoperability is not a checkbox—it is the foundation that determines how quickly new architectures can reach scale.

Open Flash Platform Initiative Aims to Redefine Flash Storage for AI

Deal

Six industry participants recently launched the Open Flash Platform (OFP) initiative, backed by six founding members: Hammerspace, the Linux Foundation, Los Alamos National Laboratory (LANL), ScaleFlux, SK hynix, and Xsight Labs.

The initiative purports to address the challenges presented by the next wave of AI-driven data storage, specifically the limitations of power, heat, and data center space.

NAND Insider Newsletter: April 21 2025

Newsletter

Each week NAND Research puts out a newsletter for our industry customers taking a look at what’s driving the week, and what happened last week that caught our attention. Below is a excerpt from this week’s, April 21, 2025.

NAND Insider Newsletter: March 3, 2025

Newspaper

Every week NAND Research puts out a newsletter for our industry customers taking a look at what’s driving the week, and what happened last week that caught our attention. Below is a excerpt from this week’s, March 3, 2025.

Research Note: Marvell Custom HBM for Cloud AI

Marvell Custom HBM

Marvell recently announced a new custom high-bandwidth memory (HBM) compute architecture that addresses the scaling challenges of XPUs in AI workloads. The new architecture enables higher compute and memory density, reduced power consumption, and lower TCO for custom XPUs.